Dynamic Duo Break New Ground In 3D Printing
By Mat Dirjish
Sensor provider HENSOLDT and printed-electronics expert Nano Dimension are claiming a breakthrough in electronics 3D printing. Using a recently-developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT is assembling the first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Allegedly, prior to this breakthrough, 3D printed boards could not bear the soldering process necessary for two-sided population of components.
HENSOLDT CEO, Thomas Müller says, “Sensor solutions require performance and reliability levels far above those of commercial components. To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.” For more details, visit HENSOLDT and Nano Dimension.
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