Dynamic Duo Break New Ground In 3D Printing

By Mat Dirjish

Sensor provider HENSOLDT and printed-electronics expert Nano Dimension are claiming a breakthrough in electronics 3D printing. Using a recently-developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT is assembling the first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Allegedly, prior to this breakthrough, 3D printed boards could not bear the soldering process necessary for two-sided population of components.

HENSOLDT CEO, Thomas Müller says, “Sensor solutions require performance and reliability levels far above those of commercial components. To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.” For more details, visit HENSOLDT and Nano Dimension.

Learn even more by signing up for Sensors Daily Newsletters. It’s free, fast, and incredibly easy. Also, review past issues at the Sensors Daily Update Archive. And for a media kit offering unique and effective sponsorship opportunities, contact Neil Howman via email.