Wafer-Based Image Sensor Targets Entry-Level Cameras
By Mat Dirjish
OmniVision expands 2-Mpixel image-sensor offerings with the OV02B 12-in., wafer-based sensor for entry-level mobile cameras. Offered as an alternative for limited-supply 8-in. wafers common to 2-Mpixel components, the OV02B employs 12-in. wafers while maintaining a die size comparable to the company’s existing 2-Mpixel sensors. This translates into an effective alternative for cost sensitive entry level and mainstream smartphones.
Using OmniPixel3-HS pixel technology, the OV02B features a 1.75-µm pixel pitch in a 1/5-in. optical format. It has an extra SCCB ID (SID) pin, which provides two available hardware I2C addresses for multicamera applications.
Other features include a hardware strobe pin to sync LED flash photography, 32 bytes of on-chip OTP memory for storing automatic white balance (AWB) and manufacturer production information, and a Bayer pattern supporting both color and monochrome while also providing a chief ray angle (CRA) up to 30.69°. Output formats include 1600×1200 at 30 fps and 800×600 at 60 fps. Need to glean more? Then checkout the OV02B spec page.
Stay ahead of the wave of image sensors and unique applications by signing up for Sensors Daily Newsletters. It’s free, fast, and outrageously easy. And for a media kit offering unique and effective sponsorship opportunities, contact Michael Mitchell via email.